아노드의 결정성에 따른 전기도금 구리박막의 기계적 특성 연구

강병학; 박지은; 박강주; 유다영; 이다정; 이동윤

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자료유형: 학술저널

저자정보: 강병학 (부산대학교 차세대기판학과 대학원) 박지은 (부산대학교 인지메카트로닉스공학과 대학원) 박강주 (부산대학교 나노융합기술학과 대학원) 유다영 (부산대학교 나노융합기술학과 대학원) 이다정 (부산대학교 나노융합기술학과 대학원) 이동윤 (부산대학교 차세대기판학과 대학원)

저널정보: 한국재료학회 한국재료학회지 한국재료학회지 제26권 제12호

발행연도: 2016.1

수록면: 714 - 720 (7page)

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We performed this study to understand the effect of a single-crystalline anode on the mechanical properties of as-deposited films during electrochemical deposition. We used a (111) single- crystalline Cu plate as an anode, and Si substrates with Cr/Au conductive seed layers were prepared for the cathode. Electrodeposition was performed with a standard 3-electrode system in copper sulfate electrolyte. Interestingly, the grain boundaries of the as-deposited Cu thin films using single-crystalline Cu anode were not distinct; this is in contrast to the easily recognizable grain boundaries of the Cu thin films that were formed using a poly-crystalline Cu anode. Tensile testing was performed to obtain the mechanical properties of the Cu thin films. Ultimate tensile strength and elongation to failure of the Cu thin films fabricated using the (111) single-crystalline Cu anode were found to have increased by approximately 52 % and 37 %, respectively, compared with those values of the Cu thin films fabricated using apoly-crystalline Cu anode. We applied ultrasonic irradiation during electrodeposition to disturb the uniform stream; we then observed no single-crystalline anode effect. Consequently, it is presumed that the single-crystalline Cu anode can induce a directional/uniform stream of ions in the electrolyte that can create films with smeared grain boundaries, which boundaries strongly affect the mechanical properties of the electrodeposited Cu films.

#thin films #electroplating #counter electrode #single crystal #tensile test

참고문헌 (18)

참고문헌 신청

R. J. Contolini / 1995 / Proc. 12th Int. VLSI Multilevel Interconnection Conf. p.322, VLSI Multilevel Interconnection Conference

C. E. Murray / 2001 / J. Appl. Phys 89:2337

C. R. Simpson / 1998 / Proc. the symposia on Electrochemical Processing in ULSI Fabrication I :59

S. Wakabayashi / 2000 / Proc. 4th Int. Conf. on adhesive Joining and Coating Technology in Electronics Manufacturing :280

김민호 / 2010 / 젤라틴 첨가에 의한 구리 박막의 기계적 특성 변화 / 대한금속·재료학회지 48(10):884~892

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