AuSn 솔더 박막의 스퍼터 증착 최적화와 접합강도에 관한 연구

김동진; 이택영; 이홍기; 김건남; 이종원

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자료유형: 학술저널

저자정보: 김동진 이택영 이홍기 김건남 이종원

저널정보: 한국마이크로전자및패키징학회 마이크로전자 및 패키징학회지 마이크로전자 및 패키징학회지 제14권 제2호

발행연도: 2007.1

수록면: 49 - 58 (10page)

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Au-Sn solder alloy were deposited in multilayer and co-sputtered film by rf-magnetron sputter and the composition control and analysis were studied. For the alloy deposition condition, each components of Au or Sn were deposited separately. On the basis of pure Sn and Au deposition, the deposition condition for Au-Sn solder alloy were set up. As variables, the substrate temperature, the rf-power, and the thickness ratio were used for the optimum composition. For multilayer solder alloy, the roughness and the composition of solder alloy were controlled more accurately at the higher substrate temperature. In contrast, for co-sputtered solder, the substrate temperature influenced little to the composition, but the composition could be controlled easily by rf-power. In addition, the co-sputtered solder film mostly consisted of intermetallic compound, which formed during deposition. The compound were confirmed by XRD. Without flux during bonding of solder alloy film on leadframe, the adhesion strength were measured. The maximum shear stress was 33(N/mm2) for multilayer solder with Au 10wt% and 46(N/mm2) for co-sputtered solder with Au 5wt%.

#Fluxless bonding1. 서?론Pb는 과거 산업계를 유지해오던 Pb-Sn계 솔더의 주된 원소이나 #환경문제가 대두되어 사용이 금지되면서 현재 무연 솔더들이 지속적으로 개발 되고 있다.1-3) 또한 플럭스는 솔더와 모재의 산화층을 제거하여 접합성을 높여주는 특성으로 널리 사용되고 있 #Pb-free solder #Au-Sn solder #Fluxless solder #Bonding strength #Electronic packaging

참고문헌 (17)

참고문헌 신청

/ 1971 / Corrosive Effects of Solder Flux on Printed-Circuit Boards IEEE Trans

/ 1985 / Diffraction effect of x-rays on the accuracy of quantitative analysis of crystals : 163 ~ 170

/ 1993 / Gold-tin alloy phase diagram and properties related to its use as a bond medium : 276 ~ 287

/ 1998 / Investigations of Au-Sn alloys on different end-metallizations for high temperature applications 20 (2) : 156 ~ 165

/ 1999 / Pb-Free Solder Alloys for Flip Chip Applications : 283 ~ 288

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