Development of High-Quality LTCC Solenoid Inductor using Solder ball and Air Cavity for 3-D SiP

Hyun-Cheol Bae; Kwang-Seong Choi; Yong-Sung Eom; 김성찬; 이종현; Jong-Tae Moon

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자료유형: 학술저널

저자정보: Hyun-Cheol Bae Kwang-Seong Choi Yong-Sung Eom 김성찬 이종현 Jong-Tae Moon

저널정보: 한국마이크로전자및패키징학회 마이크로전자 및 패키징학회지 마이크로전자 및 패키징학회지 제16권 제4호

발행연도: 2009.1

수록면: 5 - 8 (4page)

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In this paper, a high-quality low-temperature co-fired ceramic (LTCC) solenoid inductor using a solder ball and an air cavity on a silicon wafer for three-dimensional (3-D) system-in-package (SiP) is proposed. The LTCC multilayer solenoid inductor is attached using Ag paste and solder ball on a silicon wafer with the air cavity structure. The air cavity is formed on a silicon wafer through an anisotropic wet-etching technology and is able to isolate the LTCC dielectric loss which is equivalent to a low k material effect. The electrical coupling between the metal layer and the LTCC dielectric layer is decreased by adopting the air cavity. The LTCC solenoid inductor using the solder ball and the air cavity on silicon wafer has an improved Q factor and self-resonant frequency (SRF) by reducing the LTCC dielectric resistance and parasitic capacitance. Also, 3-D device stacking technologies provide an effective path to the miniaturization of electronic systems.

#LTCC solenoid inductor #high Q #air cavity #solder ball

참고문헌 (9)

참고문헌 신청

A. Sutono / 2001 / High-Q LTCC-Based Passive Library for Wireless System-on-Package(SOP) Module Development / IEEE Trans.on Microwave Theory and Techniques 49 (10) : 1715 ~ 1

A. Zolfaghari / 2001 / Stacked Inductors and Transformers in CMOS Technology / IEEE Journal of Solid-State Circuits 36 (4) : 620 ~ 628

C.P. Yue / 1998 / On-chip spiral inductors with patterned ground shields for Si-based RF ICs / IEEE Journal of Solid-State Circuits 33 : 743 ~ 752

H.C. Bae / 2007 / Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems(SiRF) / Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems(SiRF),pp.8

I.K. Ju / 2008 / High Performance Vertical Transition form DC to 70GHz for System-on-Package Applications / Proceedings of the 38th European Microwave Conference : 1338 ~ 1341

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