Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Masa ,  u Ishizuka ,  Hideo Iwasaki 외 1명

Heat Transfer Conference

1998 .08

Thermal Characteristics of a Multichip Module Using PF-5060 and Water

Min Goo Choi ,  Keum Nam Cho

KSME International Journal

1999 .05

Thermal Analysis and Optimization of 6.4 W Si-Based Multichip LED Packaged Module

Zo ,  igt Chuluunbaata ,  Nam Young Kim

한국통신학회논문지

2014 .03

THE THERMAL PERFORMANCE OF OPEN-TYPE TWO-PHASE LOOP THERMOSYPHONS FOR MULTICHIP MODULE

Won Tae Kim ,  Yoon Pyo Lee ,  Seong Young Yoon

KSME/JSME THERMAL and FLUID Engineering Conference

1996 .10

Transient Characteristics of a Two-Phase Thermosyphon Loop for Multichip Module

Sang-Sig Nam ,  Sung-Bong Choi ,  Jae-Hee Kim 외 1명

[ETRI] ETRI Journal

1998 .06

Multichip 아키텍춰 합성 알고리듬 설계 ( The design of a Synthesis Algorithm for Multichip Architectures )

박재환 ,  전홍신 ,  황선영

전자공학회논문지-A

1994 .12

Heat Transfer Characteristics of the Multichip Module with High Heat Flux

M. G. Choi ,  Keum Nam Cho

Heat Transfer Conference

1998 .08

Experimental Investigations for Thermal Mutual Evaluation in Multi-Chip Modules

Moez Ayadi ,  Sihem Bouguezzi ,  Moez Gha 외 2명

JOURNAL OF POWER ELECTRONICS

2014 .11

Influence of an Aspect Ratio of Rectangular Channel on the Cooling Performance of a Multichip Module

Min Goo Choi ,  Keum Nam Cho

KSME International Journal

2000 .03

멀티칩 모듈 기술 ( Multichip Module ( MCM ) Technology )

백경욱

대한기계학회지

1996 .10

Thermal Modelling of Power Modules

D.Silbe ,  R.Boot ,  C.Reine 외 1명

ICPE(ISPE)논문집

1992 .04

다중칩 모듈 패키징을 위한 칩 결함 방법 ( Chip-Interconnection Methods for Multichip Module Packaging )

한학수 ,  박성국 ,  김승진

대한기계학회지

1996 .10

Effect of Chip Spacing in a Multichip Module on the Heat Transfer for Paraffin Slurry Flow

Min Goo Choi ,  Keum Nam Cho

KSME International Journal

2000 .09

A Thermal Model for Electrothermal Simulation of Power Modules

Meng ,  Jinlei ,  Wen 외 5명

국제 전기 기기 및 시스템 논문지

2013 .01

EXPERIMENTAL CHARACTERISATION OF VLSI INTERCONNECTS USED IN HIGH-SPEED MULTICHIP MODULES

S. Y. Kulka ,  ni ,  K. V. V. Mu 외 1명

ICVC : International Conference on VLSI and CAD

1995 .01

멀티칩 패키지 균열의 유한요소 해석

박정순 ,  임재혁 ,  엄윤용 외 1명

대한기계학회 춘추학술대회

2005 .11

Investigation of the Thermal Mode-based Thermal Error Prediction for the Multi-heat Sources Model

Jun An Han ,  Gyu Ha Kim ,  Sun-Kyu Lee

Journal of the Korean Society for Precision Engineering

2013 .07

A Cooling System Using Wickless Heat Pipes for Multichip Modules : Experiment and Analysis

S. H. Rhi ,  W. T. Kim ,  Y. Lee

KSME International Journal

1997 .04

Transient 해석에 의한 열응력 및 변형 해석 기법에 관한 연구

이상훈 ,  정일중 ,  김동은 외 3명

대한기계학회 춘추학술대회

2007 .10

On the Numerical Responses to a Step Input in the Transient Thermal Analysis

민옥기 ,  안윤환

대한기계학회 춘추학술대회

1985 .01